Publications

2023

[C16] Liang Chen, Jincong Lu, Wentian Jin and Sheldon Tan, “Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks,” Proc. IEEE/ACM Int. Conf. Comput. Aided Design (ICCAD), San Francisco, CA, USA, 2023, pp. 1-8. (Accepted)

[C15] Subed Lamichhane, Wentian Jin, Liang Chen, Mohammadamir Kavousi and Sheldon Tan, “PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks,” Proc. IEEE/ACM Int. Conf. Comput. Aided Design (ICCAD), San Francisco, CA, USA, 2023, pp. 1-8. (Accepted)

[C14] Liang Chen, Min Tang and Jianhua Zhang, “Dynamic Electro-Thermo-Migration Coupling Analysis of RDL Structure for 2.5D Integration,” Proc. Int. Appl. Comput. Electromagn. Soc. (ACES-China) Symp., 2023. (Accepted)

[J11] Liang Chen, Wentian Jin, Mohammadamir Kavousi, Subed Lamichhane and Sheldon X.-D. Tan, “Linear Time Electromigration Analysis based on Physics-informed Sparse Regression,” IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., 2023. (Early Access)

[J10] Liang Chen, Wentian Jin, Jinwei Zhang and Sheldon X.-D. Tan, “Thermoelectric Cooler Modeling and Optimization Via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks,” IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., 2023. (Early Access)

[J9] Jinwei Zhang, Sheriff Sadiqbatcha, Liang Chen, Cuong Thi, Sachin Sachdeva, Hussam Amrouch, Sheldon X.-D. Tan, “Hot-spot aware thermoelectric array based cooling for multicore processors,” Integration, vol. 89, pp.73-82, Mar. 2023.

2022

[J8] Liang Chen, Sheriff Sadiqbatcha, Hussam Amrouch, and Sheldon X.-D. Tan, “Electrothermal Simulation and Optimal Design of Thermoelectric Cooler using Analytical Approach,” IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., vol. 41, no. 9, pp. 3066-3077, Sept. 2022.

[C13] Liang Chen, Wentian Jin and Sheldon X.-D. Tan, “Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks,” Proc. IEEE 27th Asia South Pac. Design Autom. Conf. (ASP-DAC), 2022, pp. 485-492.

[C12] Wentian Jin, Liang Chen, Subed Lamichhane, Mohammadamir Kavousi and Sheldon X.-D. Tan, “HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-informed Neural Network,” Proc. IEEE/ACM Int. Conf. Comput. Aided Design (ICCAD), San Diego, CA, USA, 2022, pp. 1-9.

[C11] Mohammadamir Kavousi, Liang Chen and Sheldon X.-D. Tan, “Fast Electromigration Stress Analysis Considering Spatial Joule Heating Effects,” Proc. IEEE 27th Asia South Pac. Design Autom. Conf. (ASP-DAC), 2022, pp. 208-213.

2021

[J7] Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang and Junfa Mao, “A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multi-Segment Interconnects,” IEEE Trans. Comput.-Aided Design Integr. Circuits Syst.,vol. 40, no. 2, pp. 350-363, Feb. 2021.

[J6] Min Tang, Liang Chen*, Bo Li, Haikun Yue, Yang Tang and Junfa Mao, “Nonlinear Thermal Analysis of AlGaN/GaN HEMTs with Temperature-dependent Parameters,” IEEE Trans. Electron Devices, vol. 68, no. 9, pp. 4565-4570, Sept. 2021.

[C10] Liang Chen and Lesley Tan, “Physics-Enforced Modeling for Insertion Loss of Transmission Lines by Deep Neural Networks,” Proc. Asia–Pacific Microw. Conf. (APMC), 2021, pp. 276-278.

[C9] Wentian Jin, Liang Chen, Sheriff Sadiqbatcha, Shaoyi Peng, and Sheldon X.-D. Tan, “EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks,” Proc. 58th ACM/IEEE Design Autom. Conf. (DAC), 2021, pp. 919-924.

[J5] Xiaoyi Wang, Shaobin Ma, Sheldon X.-D. Tan, Chase Cook, Liang Chen, Jianlei Yang and Wenjian Yu, “Fast Physics-based Electromigration Analysis for Full-chip Networks by Efficient Eigenfunction-based Solution,” IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., vol. 40, no. 3, pp. 507-520, Mar. 2021.

[J4] Han Zhou, Liang Chen and Sheldon X.-D. Tan, “Robust Power Grid Network Design Considering EM Aging Effects for Multi-Segment Wires,” Integration, vol. 77, pp.38-47, Mar. 2021.

2020

[J3] Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang and Junfa Mao, “Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires,” IEEE Trans. Very Large Scale Integr. (VLSI) Syst., vol. 28, no. 2, pp. 421-432, Feb. 2020.

[J2] Liang Chen, Min Tang, Zuhui Ma and Junfa Mao, “A novel numerical method for steady-state thermal simulation based on loop-tree and HBRWG basis functions,” Numer. Heat Transf. B: Fundam., vol. 78, no. 5, pp.348-363, Jul. 2020.

[C8] Mohammadamir Kavousi, Liang Chen and Sheldon X.-D. Tan, “Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires,” Proc. IEEE/ACM Int. Conf. Comput. Aided Design (ICCAD), 2020, pp. 1-8.

[C7] Shaoyi Peng, Wentian Jin, Liang Chen and Sheldon X.-D. Tan, “Data-Driven Fast Electrostatics Analysis based on Autoencoder Neural Networks,” Proc. ACM/IEEE 2nd Workshop Mach. Learn. CAD (MLCAD), 2020, pp. 71-76.

[C6] Shaobin Ma, Xiaoyi Wang, Sheldon X.-D. Tan, Liang Chen and Jian He, “An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks,” Proc. IEEE 25th Asia South Pac. Design Autom. Conf. (ASP-DAC), Beijing, China, 2020, pp. 38-43.

2019

[C5] Liang Chen, Min Tang, Jun Jiang, Yang Tang, Haikun Yue and Junfa Mao, “Thermal Analysis and Optimization of High-Power Planar Schottky Diodes with Different Substrates,” Proc. IEEE 2nd Int. Conf. Electron. Inf. Commun. Technol. (ICEICT), Harbin, China, 2019, pp. 435-438.

2018

[J1] Liang Chen, Min Tang and Junfa Mao, “A Semianalytical Gradient Model for Characterization of Conductors With Surface Roughness,” IEEE Trans. Microw. Theory Techn., vol. 66, no. 12, pp. 5391-5398, Dec. 2018.

[C4] Liang Chen, Min Tang and Junfa Mao, “An Analytical Gradient Model for the Characterization of Conductor Surface Roughness Effects,” Proc. IEEE MTT-S Int. Microw. Symp. Dig., Philadelphia, PA, 2018, pp. 1036-1038.

[C3] Liang Chen, Min Tang and Junfa Mao, “Electromagnetic interference investigation of PCB in metallic enclosures using ADI-FDTD method,” Proc. IEEE Int. Symp. Electromagn. Compat. IEEE Asia–Pacific Symp. Electromagn. Compat. (EMC/APEMC), Singapore, 2018, pp. 1274-1277.

2017

[C2] Liang Chen, Min Tang, Qiangqiang Feng and Junfa Mao, “Transient electromagnetic-thermal simulation of debye media using alternating-direction-implicit method,” Proc. 47th Eur. Microw. Conf. (EuMC), Nuremberg, 2017, pp. 892-895.

[C1] Liang Chen, Min Tang, Junfa Mao, Haikun Yue and Yang Tang, “Numerical calibration on complex propagation constants of grounded coplanar waveguides,” Proc. IEEE Electr. Design Adv. Packag. Syst. Symp. (EDAPS), Haining, China, 2017, pp. 1-3.