Experience

Education

Sep. 2015 – Sep. 2020 Ph.D at Shanghai Jiao Tong University, Shanghai, P. R. China
- Major: Electronic Science and Technology
- Thesis: Investigations on Multiphysics Modeling and Simulation of Integrated Circuits
- Supervisor: Prof. Junfa Mao
Nov. 2018 – Sep. 2020 Visiting Scholar at University of California, Riverside, Riverside, CA, USA
- Major: Electromigration Modeling and Simulation of Power Grid
- Supervisor: Prof. Sheldon X.-D. Tan
Sep. 2011 – Jul. 2015 B. Eng. at Northwestern Polytechnical University, Shanxi, P. R. China
- Major: Electromagnetic Field and Wireless Technology

Mar. 2023 – Present: Associate Professor at Shanghai University，Shanghai, P. R. China
- Research Topic: Machine Learning for Multiphysics Simulation of the VLSI chip
Nov. 2022 – Feb. 2023: Visiting Assistant Project Scientist at University of California, Riverside, Riverside, CA, USA
- Research Topic: Machine Learning for Thermal and Electromigration Reliability Analysis
- Supervisor: Prof. Sheldon X.-D. Tan
Nov. 2020 – Oct. 2022: Postdoctoral Researcher at University of California, Riverside, Riverside, CA, USA
- Research Topic: Machine Learning for Thermal and Electromigration Reliability Analysis
- Supervisor: Prof. Sheldon X.-D. Tan

2023 Shanghai Leading Talents (Overseas) Young Excellence
2018 Outstanding Student Scholarship of Shanghai Jiao Tong University.
2018 China Scholarship Council Scholarship
2017 National Conference on Microwave and Millimeter Wave(NCMMW) Best Paper Nomination
2016 The 13th China Post-graduate Mathematical Contest in Modeling. Third Place

Associate Editor: Integration, the VLSI Journal (2023)
TPC Member: ICCAD 2023
Session Chair: Modelling of Devices and Circuits, APMC 2021
Journal Reviewer: IEEE T-VLSI, IEEE T-CAD, IEEE T-CPMT, IEEE T-BioCAS, Microelectronics Reliability, Computational Biology and Chemistry
Conference Reviewer: SMACD 2019, MLCAD 2021